Abstract: With the great advancement of semiconductor processes, the CMOS integration on both sides of wafer provides brand new scope for advanced logic technologies by fully utilizing the wafer ...
3D Stacked FET (3DSFET) Logic and SRAM Technology Featuring Single Diffusion Break (SDB) and Back Side Interconnect (BSI) at 48 nm CPP for Advanced Mobile and High Performance Computing (HPC) ...
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