Achieving a reliable hybrid bond requires both surfaces to be pristine. To support this requirement, metrology methods such as atomic force microscopy (AFM) and atomic force profilometry (AFP) are ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...

With Moore's Law losing momentum, advanced packaging has become the industry's next significant lever to drive performance gains. At the center of this race is hybrid bonding, widely seen as the ...

A technical paper titled “Hierarchical Multi-Layer and Stacking Vias with Novel Structure by Transferrable Cu/Polymer Hybrid Bonding for High Speed Digital Applications” was published by researchers ...

SAN JOSE, Calif., June 12, 2024 (GLOBE NEWSWIRE) -- Today, Adeia Inc. (Nasdaq: ADEA), a leading R&D and intellectual property (IP) licensing company known for bringing leading innovations in the ...

LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth memory ...

Revenue for Q4 2024 was €153.4 million, with a 2% sequential decline and a 3.9% drop year-over-year, due to weaker mainstream assembly markets and lower demand for hybrid bonding and photonics ...

NHanced Semiconductors, the first U.S.-based pure-play advanced packaging foundry, announced the delivery of the first BE Semiconductor Industries (Besi) next-generation hybrid bonding system to the ...

Semiconductor machinery manufacturer Applied Materials (NASDAQ:AMAT) announced in Q4 CY2025, but sales fell by 2.1% year on ...

(Reuters) -Applied Materials has bought a 9% stake in BE Semiconductor industries (BESI), the U.S.-based computer chip equipment supplier said on Monday. The transaction makes it the largest ...