Suss MicroTec today debuted a full field proximity mask aligner for processing 300mm wafers. The MA300Plus is optimized for high-volume, high-end fabs, the company said, and is capable of a throughput ...
One of the main challenges in developing semiconductor chip technology is making electronic components smaller and more effective. This difficulty is most noticeable in lithography, which is the ...
A 3” silicon wafer is fabricated from scratch. All the fabrication steps like photolithography, mask alignment and etching are performed on the wafer to produce mosfets, capacitors, diodes and ...
The Benefits Of Curvilinear Full-Chip Inverse Lithography Technology With Mask-Wafer Co-Optimization
A technical paper titled “Make the impossible possible: use variable-shaped beam mask writers and curvilinear full-chip inverse lithography technology for 193i contacts/vias with mask-wafer ...
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