Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

The figure shows the evolution of the microstructure of the melt pool under the influence of the simulated transient temperature field. Nucleated grains are represented in pink-purple plots, while ...

Although electromechanical relays have historically been the primary load switch in most applications, MOSFETs have been encroaching on the relay's territory in recent years as technology advances ...

Linear superposition, as its name implies, is associated with linear systems. In your core undergraduate electrical circuits class, you learned that networks comprising only resistors, capacitors and ...

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are ...