Samtec has announced the availability of its SS4/ST4 Series of Ultra Micro PCB connectors. The board-to-board mated set features the smallest footprint of the company’s Ultra Micro interconnect ...
Semiconductor substrate warpage and signal loss now have a Korean challenger to glass: Viacore and Aqlaser’s low-CTE ...
The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and packaging ...
The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...
That’s a question many on the heterogeneous integration (HI) side of the semiconductor industry are asking. Unfortunately, the answer is not straightforward. But before we get to answering that, let’s ...
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