In 1999, Stig Oresjo, then of Agilent Technologies, conducted a major study of solder-joint defects on printed-circuit boards (PCBs). The study, which at the time provided the most definitive data on ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

AXI is an effective technology for finding manufacturing defects in electronics assembly operations. Manufacturers of advanced electronics products know that simultaneously producing a ...

In the run-up to pv magazine’s quality roundtable at Intersolar Europe, we look at a case where a production error resulted in cold solder joints in 5% of the solar ...