EDN

SEZ’ James Mello on batch vs. single-wafer cleaning

The following contributed article was provided to SBN by James Mello, vice president of technical operations at SEZ America, the U.S. subsidiary of the SEZ Group. SEZ America is based in Phoenix.
Nasdaq

ACM Research’s 18 Chamber, 300mm Ultra C VI Single-Wafer Cleaning Tool Enters Mass Production

ACM’s Ultra C VI Tool Supports Most Semiconductor Clean Processes for Advanced Logic, DRAM and 3D NAND Manufacturing; Provides 50% More Throughput Than 12 Chamber Tool FREMONT, Calif., April 21, 2022 ...
Nasdaq

ACM Research Ships Its First 300mm, High-Temp Single-Wafer SPM Tool for Advanced Logic, DRAM and 3D-NAND Semiconductor Manufacturing

FREMONT, Calif., Sept. 23, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
EDN

SEZ introduces Da Vinci 300-mm wafer cleaner

VILLACH, Austria — Wafer cleaning equipment provider SEZ Group has introduced to the market a series of wet-surface-preparation spin processing machines, the company said Tuesday (June 3, 2003). The ...
AZOM

NexGen Wafer Systems Introduces SERENO: A Versatile, High-Throughput Wet Etch and Clean Solution with Integrated Metrology for 6", 8", and 12" Substrates

NexGen Wafer Systems is excited to announce the launch of SERENO, its latest multi-chamber platform designed for Wet Etch and Clean applications. SERENO combines high performance with exceptional ...
Business Wire

DAS Achieves World’s First Point-of-Use Abatement of Harmful Gases in Wet Bench Semiconductor Processes

DRESDEN, Germany--(BUSINESS WIRE)--Responding with a breakthrough approach to a major semiconductor customer request, DAS Environmental Expert GmbH of Dresden, Germany, developed and installed SALIX – ...