In a new report from Business Korea, we're hearing that Samsung is making "significant strides" in the semiconductor packaging industry, "positioning itself ahead of TSMC in the Panel Level Packaging ...

Samsung Electronics is advancing development of its next-generation System-on-Panel (SoP) packaging technology, aiming to produce modules significantly larger than those possible with conventional ...

Samsung Electronics and TSMC are advancing in next-gen fan-out panel-level packaging (FOPLP), but their strategies differ. Samsung is sticking with plastic, leveraging its experience in mobile chips, ...

Fan-Out Panel-Level Packaging (FOPLP) for advanced nodes, once hindered by manufacturability and yield challenges, is emerging as a promising solution to meet the industry’s demands for higher ...