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200 V, 10 mΩ GaN FET Joins Family of Footprint Compatible QFN Packaged Devices for High Efficiency & Design Flexibility

200 V, 10 mΩ EPC2307 GaN FET in a thermally enhanced QFN in a tiny 3 mm x 5 mm footprint EPC introduces 200 V, 10 mΩ EPC2307 GaN FET optimized for DC-DC conversion, AC/DC SMPS and chargers, solar ...
Electronic Design

QFN Socket Supports 0.5-mm Pitch Chips

Housing STATSChipPAC QFN packages without significant performance loss and with a minimal increase in PCB footprint, the SG-MLF-7025 socket accommodates devices with a 0.5-mm pitch and a 10-mm package ...
EDN

QFN socket works to 40 GHz without soldering

Using a new high-performance elastomer, the SM-QFN-9019 QFN socket is designed for 13 x 19-mm mixed-pitch QFN packages and operates at bandwidths to 40 GHz with less than 1dB of insertion loss. The ...
Electronic Design

IC-Style Modules Shrink Silicon Footprint for Buck Regulators

International Rectifier's SupIRBuck family of point-of-load regulators co-package controllers and MOSFETs in compact QFN packages, reducing the silicon footprint required to implement single-output, ...