Nvidia has been working on a prototype multi-die AI accelerator chip called RC 18. The 36-module strong chip, developed by Nvidia Research, is currently being evaluated in the labs, and its highly ...

In designing multi-die systems-in-package, with or without chiplets, it is easy to think of the interconnect between dies as simply analogous to the interconnect between functional blocks on a single ...

The semiconductor industry is undertaking a major strategy shift towards multi-die systems. The shift is fueled by several converging trends: Size of monolithic SoCs is becoming too big for ...