Thermal, stress and electronics cooling in-design analysis empowers designers to utilize ECAD and MCAD seamlessly for multiphysics simulation of electro-mechanical systems Convergence of FEM and CFD ...
The figure shows the evolution of the microstructure of the melt pool under the influence of the simulated transient temperature field. Nucleated grains are represented in pink-purple plots, while ...
Typical 3D thermal simulation of electronics components assumes that all the power consumption the data sheets define is dissipated in the semiconductor. In the case of high current power modules, ...
Some of the important trends driving EV development are getting more than 200 miles out of a charge, pricing below $40,000, fast charging such as less than 30 minutes for an 80% charge, increasing ...
A major challenge in thermal-management and thermal-insulation technologies, across multiple industries, is the lack of ...
Pulsonix has introduced a direct interface with ADAM Research's TRM software, streamlining thermal simulation for PCB designers. As electronics shrink and power up, TRM's advanced modeling helps ...
The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...
The electronics industry is driven by a constant demand for smaller and more powerful devices. This means increased power densities and lots more heat being generated within ever-smaller spaces. As a ...
Gerard Torres, COO, Bold Valuable Technology and Isaac López, battery systems design engineer, Bold Valuable Technology Battery enclosures house battery cells and can be designed to help prevent and ...
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