As IC speeds continue to climb well into the gigahertz range, system designers are finding that the new obstacles they must overcome to interconnect ICs to packages and packages to printed-circuit ...

Santa Clara, Calif. — As chip designers, Kaushik Sheth and Egino Sarto struggled to fit silicon into cost-effective packages. Now they're trying to convince other chip designers to adopt a ...

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services “We are pleased to collaborate with Cadence, a leader in electronic design software, ...

Solution integrates the Virtuoso platform with Allegro and Sigrity technologies to streamline overall design process and significantly improve productivity and cycle time SAN JOSE, Calif., May 30, ...

Greater functionality, performance, and speed are in great demand in pervasive computing, RF, and automotive electronic systems, as well as most everything else. Complexity continues to skyrocket, ...

Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...

AWR V16 advances heterogeneous technology development for 5G wireless and connected systems for automotive, radar systems and semiconductor technologies Custom RF to mmWave IP developed with AWR ...

A recently developed software tool automatically checks for design-rule violations as locations are designated for wire bonds between die and package lead frames. Known as the Post-Layout Bond Tool, ...

The modern world runs on integrated circuits (ICs). From smartphones and cars to AI data centers, medical equipment, satellites, and industrial automation systems, semiconductor chips are the ...

MEYREUIL, France & SAN JOSE, Calif.--(BUSINESS WIRE)--Presto Engineering, an ASIC design and outsourced operations provider, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a ...