Achieving a reliable hybrid bond requires both surfaces to be pristine. To support this requirement, metrology methods such as atomic force microscopy (AFM) and atomic force profilometry (AFP) are ...
Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...
Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional ...
Samsung Electronics is actively enhancing its semiconductor foundry capabilities by embracing hybrid bonding technology. The company has recently integrated equipment from BE Semiconductor Industries ...
With Moore's Law losing momentum, advanced packaging has become the industry's next significant lever to drive performance gains. At the center of this race is hybrid bonding, widely seen as the ...
Transferable Hybrid Bonding Technique That Allows For High Integration Density In Advanced Packaging
A technical paper titled “Hierarchical Multi-Layer and Stacking Vias with Novel Structure by Transferrable Cu/Polymer Hybrid Bonding for High Speed Digital Applications” was published by researchers ...
SANTA CLARA, Calif., Feb. 06, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), the company whose patented innovations enhance billions of devices, today announced that it is showcasing its hybrid ...
SAN JOSE, Calif., June 12, 2024 (GLOBE NEWSWIRE) -- Today, Adeia Inc. (Nasdaq: ADEA), a leading R&D and intellectual property (IP) licensing company known for bringing leading innovations in the ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and ...
2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...
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AMAT Q4 deep dive: AI demand and advanced packaging lead guidance upside
Semiconductor machinery manufacturer Applied Materials (NASDAQ:AMAT) announced in Q4 CY2025, but sales fell by 2.1% year on ...
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