Some of the world's most advanced research in micro- and nanoelectronic-packaging reliability is taking place in the Electronic Packaging Laboratory in the UB School of Engineering and Applied ...

Humidity resistance and reliability of different packaging structures is analyzed, including the high/low temperature and temperature cycle reliability and the thermal characteristics in different ...

Electronic packaging encapsulates intricate systems whose reliability is critically affected by moisture diffusion and the resultant delamination at material interfaces. As water molecules permeate ...

This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. “With the continuous miniaturization of ...

Dr. Martin K. Anselm (Director of the Center for Electronics Manufacturing, RIT). Dr. Anselm holds an undergraduate degree in Physics, a Masters in Mechanical Engineering and a Ph.D. in Materials ...

QPT, the power electronics company, has just filed a patent for a novel way to attach dies to the heat spreaders or substrates which are typically Aluminium Nitride (AlN), which it calls qAttach.

Tools that can help identify packaging reliability risks earlier and with additional depth are becoming increasingly important. One such tool is a real-time, thermal-cycle reliability test in which ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

The integrated circuit (IC), which recently turned 50 years old, is unquestionably one of the greatest inventions of all time. This technology has transformed our world and is incredibly ubiquitous in ...