Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

Chipmakers, OSATs and R&D organizations are developing the next wave of fan-out packages for a range of applications, but sorting out the new options and finding the right solution is proving to be a ...

TSMC first developed its CoWoS package for advanced chips in 2012 and combined with HBM in 2016. The explosion of generative AI technology such as ChatGPT has been a catalyst for growth of TSMC’s ...

Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...