CIT Showcases Ultra-Flat Copper Technology, Two-Time CES Innovation Award Winner, at CES 2026

LAS VEGAS, NV, UNITED STATES, January 20, 2026 /EINPresswire.com/ — CIT (CEO Seung Jeong) announced its participation in CES 2026, the world’s largest IT and consumer electronics exhibition, held in ...

Amkor Technology, Inc. Leveraging On Growing Advanced Semiconductor Packaging

Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...
Knoxville News Sentinel

Silicon Box Enables Flexible Semiconductor Supply Chains with Advanced Packaging Technology, CEO Dr. Byung Joon Han speaks to Bloomberg News at the New Economy Forum

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as ...
Semiconductor Engineering

Low Temperature Cu-Cu Bonding for Advanced Packaging (NYCU)

A new technical paper titled “Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation ...
BW Businessworld

Paras Defence Comes With A Subsidiary Focused On Semiconductors For Defence

Paras Defence launched Paras Semiconductor to set up advanced heterogeneous & 3D chip packaging, strengthening India’s ...
Nasdaq

Amkor Technology Breaks Ground on New Semiconductor Advanced Packaging and Test Campus in Arizona; Expands Investment to $7 Billion

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

Global Demand Accelerates for Advanced Pharmaceutical and Packaging Machinery Manufacturer and Supplier Solutions

WENZHOU, ZHEJIANG PROVINCE, CHINA, January 19, 2026 /EINPresswire.com/ -- As the global pharmaceutical and healthcare ...